MB-80070
Intel® Core™ 2 Duo COM Express Module with CRT / 24-bit LVDS, LAN & Audio new_cat_mb-80070_combo.gif
Features
  • Intel® Core™ 2 Duo Pentium® M / Single Core™ Celeron® M processors
  • Intel® 945GME with ICH7M chipset
  • PICMG COM Express R1.0 compliant
  • One DDRII SO-DIMM socket
  • Intel® 82573L GbE Ethernet interface
  • Flexible PCI-Express and PCI expansion
  • Integrated Graphic support: dual SDVO, Analog VGA, 24-bit LVDS, TV-Out interface
  • Supports COM Express standard features (USB, SATA, ATA, GPIO, AC97)
  • RoHS compliant
  • Basic form factor (95mm x 125mm), pin-out type II
Specifications
System
CPU* Socket 479 to support Intel® Core™ 2 Duo Pentium® M,Intel® Single Core™ Celeron® MFSB:533/667MHz (see below table)
System Chipset Intel® 945GME, ICH7M-DH
BIOS AMI® 512KB Flash BIOS (Legacy free)
System Memory 1 x 200pin DDRII SO-DIMM socket supports400/533/667MHz memory max. up to 2GB w/o ECCregistered
Watchdog Timer 255 levels timer interval, (1 ~ 255 seconds), setup bysoftware. Jumper set up for system reset or IRQ
System Monitoring Built-in 945GME chipset, supports dual independentdisplays
Expansion Interface 5 x PCI-Express x 1PCI 2.3 32-bit 33MHz supports up to two Req/Gnt pairs
I/O
I/O Chipset Winbond® 83627HG supported by BIOS
I/O Interface 2 x SATA, 1 x LPC & I2C bus, 8 x GPIO
USB 8 x USB ports, USB 2.0/1.1 compliant
Audio AC 97 high definition Audio via ICH7M-DH I/O Hub
Ethernet
Chipset Intel® 82573L
Ethernet Interface IEEE 802.3 10/100/1000Mbps Compliant physical layer
Display
Chipset Built-in 945GME chipset supports dual independentdisplays
Features Dual SDVO, dual 24-bit LVDS channels, Analog VGAand TV-out
Memory Size 1/4/8/16/32/64MB
Resolution CRT display mode: up to 2048 x 1536LCD display mode: up to 1600 x 1200
LCD Interface LVDS
LVDS Interface Dual 24-bit LVDS
Mechanical and Environmental
Form Factor PICMG COM Express basic form factor, pin-outtype II
Dimensions 95mm (L) x 125mm (W)( 3.8” L x 5” W)
Power Supply Voltage +12V
Operating Temperature 0°C ~ 60°C ( 32°F ~ 140°F )
Storage Temperature -20°C ~ 85°C ( -4°F ~ 185°F )
Operating Humidity 10% ~ 90% relative humidity, non-condensing
Storage Humidity 5% ~ 95% relative humidity, non-condensing
Packing List
1 x MB-80070 unit1 x CD with Manual, Quick Installation Guide, Utility Drivers
Ordering Information
Standard
MB-8007B Intel® 945GME COM Express module with socket 479, CRT/24-bit LVDS,LAN, Audio
Optional
HS1 for onboard CPU
HW-C36TRS-00 Screw + type M3*0.5*L5(Ni)/ RoHS
HW-C47TRS-00 3*10 screw I type (Ni)/RoHS
HW-PAD005-00 PAD K2.2 H48-2 T1.0 (18*18mm)/ RoHS
CO-HS0109-00 Heatsink (35 x35 x2.5mm)/ RoHS
HW-60510 Heatsink (125 x 72.1 x 28.5mm)/ RoHS w/ socket
HS2 for Socket Type CPU
HW-C47TRS-00 3*10 screw I type (Ni)/ RoHS
HW-PAD005-00 PAD K2.2 H48-2 T1.0 (18*18mm)/ RoHS
HW-60510 Heatsink (125 x 72.1 x 28.5mm) /RoHS for w/socket
Processor MAX TDP Description
17W Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB)
34W Intel® Core™2 Duo Processor T7400 (4M Cache, 2.16 GHz, 667 MHz FSB)
30W Intel® Celeron® M Processor 530 (1M Cache, 1.73 GHz, 533 MHz FSB) Socket M
5.5W Intel® Celeron® M Processor ULV 423 (1M Cache, 1.06 GHz, 533 MHz FSB)
15W Intel® Core™ Duo Processor L2400 (2M Cache, 1.66 GHz, 667 MHz FSB)
27W Intel® Celeron® M Processor 440 (1M Cache, 1.86 GHz, 533 MHz FSB)
31W Intel® Core™ Duo Processor T2500 (2M Cache, 2.00 GHz, 667 MHz FSB)
10.3W (7W + 3.3W) Mobile Intel® 945GME Express Chipset with 82801GHM I/O Controller Hub 7 (ICH7MDH)
CPU Notes
§ L7400 processor is BGA only and can only be made with MOQ.§ Celeron M ULV 423 processor is BGA only and can only be made with MOQ.§ L2400 processor is BGA only and can only be made with MOQ.
When making sales inquiries provide quantity, CPU type, bus speed, and memory requirements. Specifications subject to change without prior notice.   This e-mail address is being protected from spam bots, you need JavaScript enabled to view it
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